Molecular Dynamics Study of the Sintering Behavior and Mechanical Properties of Cu@Ag Core–Shell Nanoparticle Solder Paste

Xuezhi Zhang, Jian Gao, Lanyu Zhang

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DOI: 10.3390/ma19081612
Published: 2026-04-17
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19081612,
  title = {Molecular Dynamics Study of the Sintering Behavior and Mechanical Properties of Cu@Ag Core–Shell Nanoparticle Solder Paste},
  author = {Xuezhi Zhang and Jian Gao and Lanyu Zhang},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19081612},
  url = {https://doi.org/10.3390/ma19081612}
}

RIS

TY  - JOUR
TI  - Molecular Dynamics Study of the Sintering Behavior and Mechanical Properties of Cu@Ag Core–Shell Nanoparticle Solder Paste
AU  - Xuezhi Zhang
AU  - Jian Gao
AU  - Lanyu Zhang
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19081612
UR  - https://doi.org/10.3390/ma19081612
ER  -

APA

Zhang, X., Gao, J., & Zhang, L. (2026). Molecular Dynamics Study of the Sintering Behavior and Mechanical Properties of Cu@Ag Core–Shell Nanoparticle Solder Paste. Materials. https://doi.org/10.3390/ma19081612

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crossref · retrieved 2026-11-10T15:01:27.472Z