Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling

Nina Szczotka, Shadi Nashashibi, Aleksandra Motyka, Sławomir Drozdek, Juerg Leuthold, Karol Malecha

Open source

DOI: 10.3390/ma19091861
Published: 2026-05-01
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19091861,
  title = {Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling},
  author = {Nina Szczotka and Shadi Nashashibi and Aleksandra Motyka and Sławomir Drozdek and Juerg Leuthold and Karol Malecha},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19091861},
  url = {https://doi.org/10.3390/ma19091861}
}

RIS

TY  - JOUR
TI  - Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling
AU  - Nina Szczotka
AU  - Shadi Nashashibi
AU  - Aleksandra Motyka
AU  - Sławomir Drozdek
AU  - Juerg Leuthold
AU  - Karol Malecha
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19091861
UR  - https://doi.org/10.3390/ma19091861
ER  -

APA

Szczotka, N., Nashashibi, S., Motyka, A., Drozdek, S., Leuthold, J., & Malecha, K. (2026). Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. Materials. https://doi.org/10.3390/ma19091861

Source records

crossref · retrieved 2026-09-25T15:30:53.668Z