Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.

Lin P, Tong Z, Xu S, Wang Y, Wang S, Tian Y

DOI: 10.3390/ma19112182
Published: 2026 May 22
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma19112182,
  title = {Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.},
  author = {Lin P and Tong Z and Xu S and Wang Y and Wang S and Tian Y},
  year = {2026},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma19112182},
  url = {https://doi.org/10.3390/ma19112182}
}

RIS

TY  - JOUR
TI  - Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.
AU  - Lin P
AU  - Tong Z
AU  - Xu S
AU  - Wang Y
AU  - Wang S
AU  - Tian Y
PY  - 2026
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma19112182
UR  - https://doi.org/10.3390/ma19112182
ER  -

APA

P, L., Z, T., S, X., Y, W., S, W., & Y, T. (2026). Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma19112182

Source records

pubmed · retrieved 2026-09-27T12:41:16.069Z
europe-pmc · retrieved 2026-09-27T12:41:16.093Z