Fractographic Analysis and Fatigue Crack Propagation Behavior of TC4-F Alloy with a Duplex Microstructure

Yangyang Sun, Li Liu, Zhongyang Mao, Feifei Jiang, Lian Zhou

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DOI: 10.3390/ma19112238
Published: 2026-05-25
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19112238,
  title = {Fractographic Analysis and Fatigue Crack Propagation Behavior of TC4-F Alloy with a Duplex Microstructure},
  author = {Yangyang Sun and Li Liu and Zhongyang Mao and Feifei Jiang and Lian Zhou},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19112238},
  url = {https://doi.org/10.3390/ma19112238}
}

RIS

TY  - JOUR
TI  - Fractographic Analysis and Fatigue Crack Propagation Behavior of TC4-F Alloy with a Duplex Microstructure
AU  - Yangyang Sun
AU  - Li Liu
AU  - Zhongyang Mao
AU  - Feifei Jiang
AU  - Lian Zhou
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19112238
UR  - https://doi.org/10.3390/ma19112238
ER  -

APA

Sun, Y., Liu, L., Mao, Z., Jiang, F., & Zhou, L. (2026). Fractographic Analysis and Fatigue Crack Propagation Behavior of TC4-F Alloy with a Duplex Microstructure. Materials. https://doi.org/10.3390/ma19112238

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crossref · retrieved 2026-11-10T10:35:37.335Z