Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging.

Park JY, Yoo S

DOI: 10.3390/ma19143138
Published: 2026 Jul 22
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma19143138,
  title = {Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt\%Zn Solder Joints Under Isothermal Aging.},
  author = {Park JY and Yoo S},
  year = {2026},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma19143138},
  url = {https://doi.org/10.3390/ma19143138}
}

RIS

TY  - JOUR
TI  - Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging.
AU  - Park JY
AU  - Yoo S
PY  - 2026
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma19143138
UR  - https://doi.org/10.3390/ma19143138
ER  -

APA

JY, P., & S, Y. (2026). Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma19143138

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pubmed · retrieved 2026-09-25T13:14:14.540Z