Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints

Shuai Meng, Mingliang Huang

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DOI: 10.3390/ma19173655
Published: 2026-08-28
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19173655,
  title = {Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints},
  author = {Shuai Meng and Mingliang Huang},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19173655},
  url = {https://doi.org/10.3390/ma19173655}
}

RIS

TY  - JOUR
TI  - Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints
AU  - Shuai Meng
AU  - Mingliang Huang
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19173655
UR  - https://doi.org/10.3390/ma19173655
ER  -

APA

Meng, S., & Huang, M. (2026). Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints. Materials. https://doi.org/10.3390/ma19173655

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crossref · retrieved 2026-11-10T10:24:50.021Z