Microstructural Evolution in Solid-State Sn–Zn/Ag/Cu Interfacial Reactions at 170 °C

Chao-Hong Wang, Chu-An Li

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DOI: 10.3390/ma19194217
Published: 2026-10-03
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19194217,
  title = {Microstructural Evolution in Solid-State Sn–Zn/Ag/Cu Interfacial Reactions at 170 °C},
  author = {Chao-Hong Wang and Chu-An Li},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19194217},
  url = {https://doi.org/10.3390/ma19194217}
}

RIS

TY  - JOUR
TI  - Microstructural Evolution in Solid-State Sn–Zn/Ag/Cu Interfacial Reactions at 170 °C
AU  - Chao-Hong Wang
AU  - Chu-An Li
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19194217
UR  - https://doi.org/10.3390/ma19194217
ER  -

APA

Wang, C., & Li, C. (2026). Microstructural Evolution in Solid-State Sn–Zn/Ag/Cu Interfacial Reactions at 170 °C. Materials. https://doi.org/10.3390/ma19194217

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crossref · retrieved 2026-11-10T08:48:11.119Z