Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.

Lee CC, Tzeng TL, Huang PC

DOI: 10.3390/ma8085121
Published: 2015 Aug 7
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma8085121,
  title = {Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.},
  author = {Lee CC and Tzeng TL and Huang PC},
  year = {2015},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma8085121},
  url = {https://doi.org/10.3390/ma8085121}
}

RIS

TY  - JOUR
TI  - Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.
AU  - Lee CC
AU  - Tzeng TL
AU  - Huang PC
PY  - 2015
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma8085121
UR  - https://doi.org/10.3390/ma8085121
ER  -

APA

CC, L., TL, T., & PC, H. (2015). Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma8085121

Source records

pubmed · retrieved 2026-11-10T06:49:50.318Z