Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards

Cheng-Hung Huang, Hao-Wei Su

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DOI: 10.3390/math14020327
Published: 2026-01-18
Container: Mathematics
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/math14020327,
  title = {Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards},
  author = {Cheng-Hung Huang and Hao-Wei Su},
  year = {2026},
  journal = {Mathematics},
  doi = {10.3390/math14020327},
  url = {https://doi.org/10.3390/math14020327}
}

RIS

TY  - JOUR
TI  - Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards
AU  - Cheng-Hung Huang
AU  - Hao-Wei Su
PY  - 2026
JO  - Mathematics
DO  - 10.3390/math14020327
UR  - https://doi.org/10.3390/math14020327
ER  -

APA

Huang, C., & Su, H. (2026). Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards. Mathematics. https://doi.org/10.3390/math14020327

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crossref · retrieved 2026-09-25T23:15:32.772Z