Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells

Jeff Shan, Chung-Hsuan Shan, Craig Huang, Yu-Ping Wu, Yuan-Kai Lia, Wen-Jauh Chen

Open source

DOI
10.3390/met13071223
Published
2023-07-02
Container
Metals
Publisher
MDPI AG
Open access
unknown

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BibTeX

@article{allodium:10.3390/met13071223,
  title = {Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells},
  author = {Jeff Shan and Chung-Hsuan Shan and Craig Huang and Yu-Ping Wu and Yuan-Kai Lia and Wen-Jauh Chen},
  year = {2023},
  journal = {Metals},
  doi = {10.3390/met13071223},
  url = {https://doi.org/10.3390/met13071223}
}

RIS

TY  - JOUR
TI  - Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells
AU  - Jeff Shan
AU  - Chung-Hsuan Shan
AU  - Craig Huang
AU  - Yu-Ping Wu
AU  - Yuan-Kai Lia
AU  - Wen-Jauh Chen
PY  - 2023
JO  - Metals
DO  - 10.3390/met13071223
UR  - https://doi.org/10.3390/met13071223
ER  - 

APA

Shan, J., Shan, C., Huang, C., Wu, Y., Lia, Y., & Chen, W. (2023). Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells. Metals. https://doi.org/10.3390/met13071223

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