Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells
- DOI
- 10.3390/met13071223
- Published
- 2023-07-02
- Container
- Metals
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/met13071223,
title = {Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells},
author = {Jeff Shan and Chung-Hsuan Shan and Craig Huang and Yu-Ping Wu and Yuan-Kai Lia and Wen-Jauh Chen},
year = {2023},
journal = {Metals},
doi = {10.3390/met13071223},
url = {https://doi.org/10.3390/met13071223}
}RIS
TY - JOUR TI - Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells AU - Jeff Shan AU - Chung-Hsuan Shan AU - Craig Huang AU - Yu-Ping Wu AU - Yuan-Kai Lia AU - Wen-Jauh Chen PY - 2023 JO - Metals DO - 10.3390/met13071223 UR - https://doi.org/10.3390/met13071223 ER -
APA
Shan, J., Shan, C., Huang, C., Wu, Y., Lia, Y., & Chen, W. (2023). Study of Microstructure and Mechanical Properties of Electrodeposited Cu on Silicon Heterojunction Solar Cells. Metals. https://doi.org/10.3390/met13071223
Source records
- crossref · retrieved 2026-09-25T19:20:08.098Z