Analysis of Orthogonal Coupling Structure Based on Double Three-Contact Vertical Hall Device

Rongshan Wei, Yuxuan Du

Open source

DOI: 10.3390/mi10090610
Published: 2019-09-14
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi10090610,
  title = {Analysis of Orthogonal Coupling Structure Based on Double Three-Contact Vertical Hall Device},
  author = {Rongshan Wei and Yuxuan Du},
  year = {2019},
  journal = {Micromachines},
  doi = {10.3390/mi10090610},
  url = {https://doi.org/10.3390/mi10090610}
}

RIS

TY  - JOUR
TI  - Analysis of Orthogonal Coupling Structure Based on Double Three-Contact Vertical Hall Device
AU  - Rongshan Wei
AU  - Yuxuan Du
PY  - 2019
JO  - Micromachines
DO  - 10.3390/mi10090610
UR  - https://doi.org/10.3390/mi10090610
ER  -

APA

Wei, R., & Du, Y. (2019). Analysis of Orthogonal Coupling Structure Based on Double Three-Contact Vertical Hall Device. Micromachines. https://doi.org/10.3390/mi10090610

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crossref · retrieved 2026-11-10T07:22:58.964Z