Sidewall Slope Control of InP Via Holes for 3D Integration.

Lee J, Roh K, Lim SK, Kim Y

DOI: 10.3390/mi12010089
Published: 2021 Jan 16
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi12010089,
  title = {Sidewall Slope Control of InP Via Holes for 3D Integration.},
  author = {Lee J and Roh K and Lim SK and Kim Y},
  year = {2021},
  journal = {Micromachines},
  doi = {10.3390/mi12010089},
  url = {https://doi.org/10.3390/mi12010089}
}

RIS

TY  - JOUR
TI  - Sidewall Slope Control of InP Via Holes for 3D Integration.
AU  - Lee J
AU  - Roh K
AU  - Lim SK
AU  - Kim Y
PY  - 2021
JO  - Micromachines
DO  - 10.3390/mi12010089
UR  - https://doi.org/10.3390/mi12010089
ER  -

APA

J, L., K, R., SK, L., & Y, K. (2021). Sidewall Slope Control of InP Via Holes for 3D Integration.. Micromachines. https://doi.org/10.3390/mi12010089

Source records

pubmed · retrieved 2026-11-10T13:25:46.255Z