Sidewall Slope Control of InP Via Holes for 3D Integration.

Lee J, Lee J, Roh K, Lim SK, Kim Y.

Open source

DOI: 10.3390/mi12010089
Published: 2021-01-16
Container: Micromachines (Basel)
Publisher: Not recorded
Open access: yes

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uncertain Score 53/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

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Cite this work

BibTeX

@article{allodium:10.3390/mi12010089,
  title = {Sidewall Slope Control of InP Via Holes for 3D Integration.},
  author = {Lee J and  Lee J and  Roh K and  Lim SK and  Kim Y.},
  year = {2021},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi12010089},
  url = {https://doi.org/10.3390/mi12010089}
}

RIS

TY  - JOUR
TI  - Sidewall Slope Control of InP Via Holes for 3D Integration.
AU  - Lee J
AU  -  Lee J
AU  -  Roh K
AU  -  Lim SK
AU  -  Kim Y.
PY  - 2021
JO  - Micromachines (Basel)
DO  - 10.3390/mi12010089
UR  - https://doi.org/10.3390/mi12010089
ER  -

APA

J, L., J, L., K, R., SK, L., & Y., K. (2021). Sidewall Slope Control of InP Via Holes for 3D Integration.. Micromachines (Basel). https://doi.org/10.3390/mi12010089

Source records

europe-pmc · retrieved 2026-09-26T01:12:36.318Z
doaj · retrieved 2026-09-26T01:12:36.329Z