Measurement of Residual Stress and Young's Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on <111> and <100> Silicon.

Sapienza S, Ferri M, Belsito L, Marini D, Zielinski M, La Via F, Roncaglia A

Open source

DOI
10.3390/mi12091072
Published
2021 Sep 3
Container
Micromachines
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.3390/mi12091072,
  title = {Measurement of Residual Stress and Young's Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on <111> and <100> Silicon.},
  author = {Sapienza S and Ferri M and Belsito L and Marini D and Zielinski M and La Via F and Roncaglia A},
  year = {2021},
  journal = {Micromachines},
  doi = {10.3390/mi12091072},
  url = {https://doi.org/10.3390/mi12091072}
}

RIS

TY  - JOUR
TI  - Measurement of Residual Stress and Young's Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on <111> and <100> Silicon.
AU  - Sapienza S
AU  - Ferri M
AU  - Belsito L
AU  - Marini D
AU  - Zielinski M
AU  - La Via F
AU  - Roncaglia A
PY  - 2021
JO  - Micromachines
DO  - 10.3390/mi12091072
UR  - https://doi.org/10.3390/mi12091072
ER  - 

APA

S, S., M, F., L, B., D, M., M, Z., F, L. V., & A, R. (2021). Measurement of Residual Stress and Young's Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on <111> and <100> Silicon.. Micromachines. https://doi.org/10.3390/mi12091072

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