Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact.

Liu Z, Fang M, Shi L, Gu Y, Chen Z, Zhu W

DOI: 10.3390/mi13020281
Published: 2022 Feb 10
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi13020281,
  title = {Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact.},
  author = {Liu Z and Fang M and Shi L and Gu Y and Chen Z and Zhu W},
  year = {2022},
  journal = {Micromachines},
  doi = {10.3390/mi13020281},
  url = {https://doi.org/10.3390/mi13020281}
}

RIS

TY  - JOUR
TI  - Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact.
AU  - Liu Z
AU  - Fang M
AU  - Shi L
AU  - Gu Y
AU  - Chen Z
AU  - Zhu W
PY  - 2022
JO  - Micromachines
DO  - 10.3390/mi13020281
UR  - https://doi.org/10.3390/mi13020281
ER  -

APA

Z, L., M, F., L, S., Y, G., Z, C., & W, Z. (2022). Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact.. Micromachines. https://doi.org/10.3390/mi13020281

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pubmed · retrieved 2026-09-25T04:30:38.581Z