Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration.

Chen X, Chen Z, Xiao L, Hao Y, Wang H, Ding Y, Zhang Z.

Open source

DOI: 10.3390/mi13071147
Published: 2022-07-20
Container: Micromachines (Basel)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi13071147,
  title = {Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration.},
  author = {Chen X and  Chen Z and  Xiao L and  Hao Y and  Wang H and  Ding Y and  Zhang Z.},
  year = {2022},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi13071147},
  url = {https://doi.org/10.3390/mi13071147}
}

RIS

TY  - JOUR
TI  - Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration.
AU  - Chen X
AU  -  Chen Z
AU  -  Xiao L
AU  -  Hao Y
AU  -  Wang H
AU  -  Ding Y
AU  -  Zhang Z.
PY  - 2022
JO  - Micromachines (Basel)
DO  - 10.3390/mi13071147
UR  - https://doi.org/10.3390/mi13071147
ER  -

APA

X, C., Z, C., L, X., Y, H., H, W., Y, D., & Z., Z. (2022). Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration.. Micromachines (Basel). https://doi.org/10.3390/mi13071147

Source records

europe-pmc · retrieved 2026-09-26T00:06:36.411Z
doaj · retrieved 2026-09-26T00:06:36.431Z