Reliability Evaluation Based on Mathematical Degradation Model for Vacuum Packaged MEMS Sensor.

Du G, Dong X, Huang X, Su W, Zhang P

DOI: 10.3390/mi13101713
Published: 2022 Oct 11
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi13101713,
  title = {Reliability Evaluation Based on Mathematical Degradation Model for Vacuum Packaged MEMS Sensor.},
  author = {Du G and Dong X and Huang X and Su W and Zhang P},
  year = {2022},
  journal = {Micromachines},
  doi = {10.3390/mi13101713},
  url = {https://doi.org/10.3390/mi13101713}
}

RIS

TY  - JOUR
TI  - Reliability Evaluation Based on Mathematical Degradation Model for Vacuum Packaged MEMS Sensor.
AU  - Du G
AU  - Dong X
AU  - Huang X
AU  - Su W
AU  - Zhang P
PY  - 2022
JO  - Micromachines
DO  - 10.3390/mi13101713
UR  - https://doi.org/10.3390/mi13101713
ER  -

APA

G, D., X, D., X, H., W, S., & P, Z. (2022). Reliability Evaluation Based on Mathematical Degradation Model for Vacuum Packaged MEMS Sensor.. Micromachines. https://doi.org/10.3390/mi13101713

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pubmed · retrieved 2026-09-25T06:19:24.283Z