Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO<sub>2</sub> Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing.

Lee Y, You Y, Cho C, Kim S, Lee J, Kim M, Lee H, You Y, Kim K, You S.

Open source

DOI: 10.3390/mi13111856
Published: 2022-10-29
Container: Micromachines (Basel)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi13111856,
  title = {Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO<sub>2</sub> Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing.},
  author = {Lee Y and  You Y and  Cho C and  Kim S and  Lee J and  Kim M and  Lee H and  You Y and  Kim K and  You S.},
  year = {2022},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi13111856},
  url = {https://doi.org/10.3390/mi13111856}
}

RIS

TY  - JOUR
TI  - Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO<sub>2</sub> Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing.
AU  - Lee Y
AU  -  You Y
AU  -  Cho C
AU  -  Kim S
AU  -  Lee J
AU  -  Kim M
AU  -  Lee H
AU  -  You Y
AU  -  Kim K
AU  -  You S.
PY  - 2022
JO  - Micromachines (Basel)
DO  - 10.3390/mi13111856
UR  - https://doi.org/10.3390/mi13111856
ER  -

APA

Y, L., Y, Y., C, C., S, K., J, L., M, K., H, L., Y, Y., K, K., & S., Y. (2022). Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO<sub>2</sub> Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing.. Micromachines (Basel). https://doi.org/10.3390/mi13111856

Source records

europe-pmc · retrieved 2026-09-26T00:28:07.316Z
doaj · retrieved 2026-09-26T00:28:07.338Z
hal · retrieved 2026-09-26T00:28:07.352Z