Multi-Band Power Amplifier Module with Back-Off Efficiency Improvement using Ultra-Compact 3D Vertical Stack Multi-Chip Package for Cellular Handsets.

Zhang Z, Li J, Peng L, Sun B.

Open source

DOI
10.3390/mi13111976
Published
2022-11-15
Container
Micromachines (Basel)
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.3390/mi13111976,
  title = {Multi-Band Power Amplifier Module with Back-Off Efficiency Improvement using Ultra-Compact 3D Vertical Stack Multi-Chip Package for Cellular Handsets.},
  author = {Zhang Z and  Li J and  Peng L and  Sun B.},
  year = {2022},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi13111976},
  url = {https://doi.org/10.3390/mi13111976}
}

RIS

TY  - JOUR
TI  - Multi-Band Power Amplifier Module with Back-Off Efficiency Improvement using Ultra-Compact 3D Vertical Stack Multi-Chip Package for Cellular Handsets.
AU  - Zhang Z
AU  -  Li J
AU  -  Peng L
AU  -  Sun B.
PY  - 2022
JO  - Micromachines (Basel)
DO  - 10.3390/mi13111976
UR  - https://doi.org/10.3390/mi13111976
ER  - 

APA

Z, Z., J, L., L, P., & B., S. (2022). Multi-Band Power Amplifier Module with Back-Off Efficiency Improvement using Ultra-Compact 3D Vertical Stack Multi-Chip Package for Cellular Handsets.. Micromachines (Basel). https://doi.org/10.3390/mi13111976

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