Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology.

Dong H, Ding Y, Wang H, Pan X, Zhou M, Zhang Z.

Open source

DOI
10.3390/mi14061251
Published
2023-06-14
Container
Micromachines (Basel)
Publisher
Not recorded
Open access
yes

Credibility signals

uncertain Score 53/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.3390/mi14061251,
  title = {Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology.},
  author = {Dong H and  Ding Y and  Wang H and  Pan X and  Zhou M and  Zhang Z.},
  year = {2023},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi14061251},
  url = {https://doi.org/10.3390/mi14061251}
}

RIS

TY  - JOUR
TI  - Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology.
AU  - Dong H
AU  -  Ding Y
AU  -  Wang H
AU  -  Pan X
AU  -  Zhou M
AU  -  Zhang Z.
PY  - 2023
JO  - Micromachines (Basel)
DO  - 10.3390/mi14061251
UR  - https://doi.org/10.3390/mi14061251
ER  -

APA

H, D., Y, D., H, W., X, P., M, Z., & Z., Z. (2023). Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology.. Micromachines (Basel). https://doi.org/10.3390/mi14061251

Source records