Effect of Solder Layer Void Damage on the Temperature of IGBT Modules.

Xu P, Liu P, Yan L, Zhang Z

DOI: 10.3390/mi14071344
Published: 2023 Jun 30
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi14071344,
  title = {Effect of Solder Layer Void Damage on the Temperature of IGBT Modules.},
  author = {Xu P and Liu P and Yan L and Zhang Z},
  year = {2023},
  journal = {Micromachines},
  doi = {10.3390/mi14071344},
  url = {https://doi.org/10.3390/mi14071344}
}

RIS

TY  - JOUR
TI  - Effect of Solder Layer Void Damage on the Temperature of IGBT Modules.
AU  - Xu P
AU  - Liu P
AU  - Yan L
AU  - Zhang Z
PY  - 2023
JO  - Micromachines
DO  - 10.3390/mi14071344
UR  - https://doi.org/10.3390/mi14071344
ER  -

APA

P, X., P, L., L, Y., & Z, Z. (2023). Effect of Solder Layer Void Damage on the Temperature of IGBT Modules.. Micromachines. https://doi.org/10.3390/mi14071344

Source records

pubmed · retrieved 2026-09-25T20:15:54.307Z