Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration.

Lykova M, Panchenko I, Schneider-Ramelow M, Suga T, Mu F, Buschbeck R

DOI: 10.3390/mi14071365
Published: 2023 Jun 30
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi14071365,
  title = {Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration.},
  author = {Lykova M and Panchenko I and Schneider-Ramelow M and Suga T and Mu F and Buschbeck R},
  year = {2023},
  journal = {Micromachines},
  doi = {10.3390/mi14071365},
  url = {https://doi.org/10.3390/mi14071365}
}

RIS

TY  - JOUR
TI  - Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration.
AU  - Lykova M
AU  - Panchenko I
AU  - Schneider-Ramelow M
AU  - Suga T
AU  - Mu F
AU  - Buschbeck R
PY  - 2023
JO  - Micromachines
DO  - 10.3390/mi14071365
UR  - https://doi.org/10.3390/mi14071365
ER  -

APA

M, L., I, P., M, S., T, S., F, M., & R, B. (2023). Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration.. Micromachines. https://doi.org/10.3390/mi14071365

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pubmed · retrieved 2026-09-25T22:21:03.273Z