Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing

Pengjie Zheng, Dewen Zhao, Xinchun Lu

Open source

DOI: 10.3390/mi14091683
Published: 2023-08-28
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi14091683,
  title = {Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing},
  author = {Pengjie Zheng and Dewen Zhao and Xinchun Lu},
  year = {2023},
  journal = {Micromachines},
  doi = {10.3390/mi14091683},
  url = {https://doi.org/10.3390/mi14091683}
}

RIS

TY  - JOUR
TI  - Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing
AU  - Pengjie Zheng
AU  - Dewen Zhao
AU  - Xinchun Lu
PY  - 2023
JO  - Micromachines
DO  - 10.3390/mi14091683
UR  - https://doi.org/10.3390/mi14091683
ER  -

APA

Zheng, P., Zhao, D., & Lu, X. (2023). Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing. Micromachines. https://doi.org/10.3390/mi14091683

Source records

crossref · retrieved 2026-09-24T18:52:16.401Z