Ultrathin Small Outline Package Key Techniques for High-Speed Chips with Multi-Leads.

Zhang L, Dang W, Wang Y, Zhang J

DOI: 10.3390/mi15081029
Published: 2024 Aug 13
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi15081029,
  title = {Ultrathin Small Outline Package Key Techniques for High-Speed Chips with Multi-Leads.},
  author = {Zhang L and Dang W and Wang Y and Zhang J},
  year = {2024},
  journal = {Micromachines},
  doi = {10.3390/mi15081029},
  url = {https://doi.org/10.3390/mi15081029}
}

RIS

TY  - JOUR
TI  - Ultrathin Small Outline Package Key Techniques for High-Speed Chips with Multi-Leads.
AU  - Zhang L
AU  - Dang W
AU  - Wang Y
AU  - Zhang J
PY  - 2024
JO  - Micromachines
DO  - 10.3390/mi15081029
UR  - https://doi.org/10.3390/mi15081029
ER  -

APA

L, Z., W, D., Y, W., & J, Z. (2024). Ultrathin Small Outline Package Key Techniques for High-Speed Chips with Multi-Leads.. Micromachines. https://doi.org/10.3390/mi15081029

Source records

pubmed · retrieved 2026-09-25T11:09:46.095Z