Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips

Xunyu Li, Zijin Pan, Weiquan Hao, Runyu Miao, Zijian Yue, Albert Wang

Open source

DOI: 10.3390/mi16040488
Published: 2025-04-21
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi16040488,
  title = {Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips},
  author = {Xunyu Li and Zijin Pan and Weiquan Hao and Runyu Miao and Zijian Yue and Albert Wang},
  year = {2025},
  journal = {Micromachines},
  doi = {10.3390/mi16040488},
  url = {https://doi.org/10.3390/mi16040488}
}

RIS

TY  - JOUR
TI  - Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips
AU  - Xunyu Li
AU  - Zijin Pan
AU  - Weiquan Hao
AU  - Runyu Miao
AU  - Zijian Yue
AU  - Albert Wang
PY  - 2025
JO  - Micromachines
DO  - 10.3390/mi16040488
UR  - https://doi.org/10.3390/mi16040488
ER  -

APA

Li, X., Pan, Z., Hao, W., Miao, R., Yue, Z., & Wang, A. (2025). Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips. Micromachines. https://doi.org/10.3390/mi16040488

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crossref · retrieved 2026-09-25T21:12:03.199Z