Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias.

Ha H, Kim H, Lee S, Choi S, Choi C, Yusoff WYW, Shan A, Lim S, Hwang B

DOI: 10.3390/mi16090968
Published: 2025 Aug 22
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi16090968,
  title = {Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias.},
  author = {Ha H and Kim H and Lee S and Choi S and Choi C and Yusoff WYW and Shan A and Lim S and Hwang B},
  year = {2025},
  journal = {Micromachines},
  doi = {10.3390/mi16090968},
  url = {https://doi.org/10.3390/mi16090968}
}

RIS

TY  - JOUR
TI  - Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias.
AU  - Ha H
AU  - Kim H
AU  - Lee S
AU  - Choi S
AU  - Choi C
AU  - Yusoff WYW
AU  - Shan A
AU  - Lim S
AU  - Hwang B
PY  - 2025
JO  - Micromachines
DO  - 10.3390/mi16090968
UR  - https://doi.org/10.3390/mi16090968
ER  -

APA

H, H., H, K., S, L., S, C., C, C., WYW, Y., A, S., S, L., & B, H. (2025). Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias.. Micromachines. https://doi.org/10.3390/mi16090968

Source records

pubmed · retrieved 2026-11-10T13:25:48.619Z