Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules

Jibing Chen, Yanfeng Liu, Bowen Liu, Yiping Wu

Open source

DOI: 10.3390/mi16091023
Published: 2025-09-05
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

supportingDOI registered: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
supportingDOI resolves: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility. Source: DOAJ; license: CC0
not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredROR affiliation: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredOpen access status: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication license: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication version: A publication version was supplied but is not scored. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
supportingMetadata completeness: All 6 scored descriptive metadata groups are present. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.3390/mi16091023,
  title = {Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules},
  author = {Jibing Chen and Yanfeng Liu and Bowen Liu and Yiping Wu},
  year = {2025},
  journal = {Micromachines},
  doi = {10.3390/mi16091023},
  url = {https://doi.org/10.3390/mi16091023}
}

RIS

TY  - JOUR
TI  - Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules
AU  - Jibing Chen
AU  - Yanfeng Liu
AU  - Bowen Liu
AU  - Yiping Wu
PY  - 2025
JO  - Micromachines
DO  - 10.3390/mi16091023
UR  - https://doi.org/10.3390/mi16091023
ER  -

APA

Chen, J., Liu, Y., Liu, B., & Wu, Y. (2025). Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules. Micromachines. https://doi.org/10.3390/mi16091023

Source records

crossref · retrieved 2026-11-10T07:32:14.814Z