Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis
- DOI
- 10.3390/mi16111292
- Published
- 2025-11-18
- Container
- Micromachines
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/mi16111292,
title = {Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis},
author = {Pan Li and Jin Huang and Jie Zhang and Hongxiao Gong and Jianjun Wang and Daijiang Zuo and Mengyang Su and Jiwei Shi},
year = {2025},
journal = {Micromachines},
doi = {10.3390/mi16111292},
url = {https://doi.org/10.3390/mi16111292}
}RIS
TY - JOUR TI - Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis AU - Pan Li AU - Jin Huang AU - Jie Zhang AU - Hongxiao Gong AU - Jianjun Wang AU - Daijiang Zuo AU - Mengyang Su AU - Jiwei Shi PY - 2025 JO - Micromachines DO - 10.3390/mi16111292 UR - https://doi.org/10.3390/mi16111292 ER -
APA
Li, P., Huang, J., Zhang, J., Gong, H., Wang, J., Zuo, D., Su, M., & Shi, J. (2025). Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines. https://doi.org/10.3390/mi16111292
Source records
- crossref · retrieved 2026-09-25T01:48:19.094Z