An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.

Wang Z, Fang W, Yang Y.

Open source

DOI: 10.3390/mi16121403
Published: 2025-12-12
Container: Micromachines (Basel)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi16121403,
  title = {An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.},
  author = {Wang Z and  Fang W and  Yang Y.},
  year = {2025},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi16121403},
  url = {https://doi.org/10.3390/mi16121403}
}

RIS

TY  - JOUR
TI  - An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.
AU  - Wang Z
AU  -  Fang W
AU  -  Yang Y.
PY  - 2025
JO  - Micromachines (Basel)
DO  - 10.3390/mi16121403
UR  - https://doi.org/10.3390/mi16121403
ER  -

APA

Z, W., W, F., & Y., Y. (2025). An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.. Micromachines (Basel). https://doi.org/10.3390/mi16121403

Source records

europe-pmc · retrieved 2026-09-25T16:27:55.112Z
doaj · retrieved 2026-09-25T16:27:55.094Z