An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.

Wang Z, Fang W, Yang Y

DOI: 10.3390/mi16121403
Published: 2025 Dec 12
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi16121403,
  title = {An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.},
  author = {Wang Z and Fang W and Yang Y},
  year = {2025},
  journal = {Micromachines},
  doi = {10.3390/mi16121403},
  url = {https://doi.org/10.3390/mi16121403}
}

RIS

TY  - JOUR
TI  - An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.
AU  - Wang Z
AU  - Fang W
AU  - Yang Y
PY  - 2025
JO  - Micromachines
DO  - 10.3390/mi16121403
UR  - https://doi.org/10.3390/mi16121403
ER  -

APA

Z, W., W, F., & Y, Y. (2025). An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments.. Micromachines. https://doi.org/10.3390/mi16121403

Source records

pubmed · retrieved 2026-11-10T08:19:41.658Z