A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs

Xinyi Yang, Zhen Hu, Yizhi Bo, Tao Shi, Man Cui

Open source

DOI: 10.3390/mi17010070
Published: 2026-01-01
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17010070,
  title = {A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs},
  author = {Xinyi Yang and Zhen Hu and Yizhi Bo and Tao Shi and Man Cui},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17010070},
  url = {https://doi.org/10.3390/mi17010070}
}

RIS

TY  - JOUR
TI  - A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs
AU  - Xinyi Yang
AU  - Zhen Hu
AU  - Yizhi Bo
AU  - Tao Shi
AU  - Man Cui
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17010070
UR  - https://doi.org/10.3390/mi17010070
ER  -

APA

Yang, X., Hu, Z., Bo, Y., Shi, T., & Cui, M. (2026). A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs. Micromachines. https://doi.org/10.3390/mi17010070

Source records

crossref · retrieved 2026-11-10T07:21:25.991Z