P-N Nanoporous Silicon Fabrication Using Photoelectrochemical Etching and Ultrasonic Vibration and Liquid-Phase Bonding for Optoelectronic Applications.

Chiang CC, Immanuel PN

DOI: 10.3390/mi17010073
Published: 2026 Jan 4
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17010073,
  title = {P-N Nanoporous Silicon Fabrication Using Photoelectrochemical Etching and Ultrasonic Vibration and Liquid-Phase Bonding for Optoelectronic Applications.},
  author = {Chiang CC and Immanuel PN},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17010073},
  url = {https://doi.org/10.3390/mi17010073}
}

RIS

TY  - JOUR
TI  - P-N Nanoporous Silicon Fabrication Using Photoelectrochemical Etching and Ultrasonic Vibration and Liquid-Phase Bonding for Optoelectronic Applications.
AU  - Chiang CC
AU  - Immanuel PN
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17010073
UR  - https://doi.org/10.3390/mi17010073
ER  -

APA

CC, C., & PN, I. (2026). P-N Nanoporous Silicon Fabrication Using Photoelectrochemical Etching and Ultrasonic Vibration and Liquid-Phase Bonding for Optoelectronic Applications.. Micromachines. https://doi.org/10.3390/mi17010073

Source records

pubmed · retrieved 2026-09-26T15:45:46.623Z