Thermal-Electrical Fusion for Real-Time Condition Monitoring of IGBT Modules in Transportation Systems.

Cui M, Liu Y, Hu Z, Shi T.

Open source

DOI: 10.3390/mi17020154
Published: 2026-01-25
Container: Micromachines (Basel)
Publisher: Not recorded
Open access: yes

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uncertain Score 53/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

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Cite this work

BibTeX

@article{allodium:10.3390/mi17020154,
  title = {Thermal-Electrical Fusion for Real-Time Condition Monitoring of IGBT Modules in Transportation Systems.},
  author = {Cui M and  Liu Y and  Hu Z and  Shi T.},
  year = {2026},
  journal = {Micromachines (Basel)},
  doi = {10.3390/mi17020154},
  url = {https://doi.org/10.3390/mi17020154}
}

RIS

TY  - JOUR
TI  - Thermal-Electrical Fusion for Real-Time Condition Monitoring of IGBT Modules in Transportation Systems.
AU  - Cui M
AU  -  Liu Y
AU  -  Hu Z
AU  -  Shi T.
PY  - 2026
JO  - Micromachines (Basel)
DO  - 10.3390/mi17020154
UR  - https://doi.org/10.3390/mi17020154
ER  -

APA

M, C., Y, L., Z, H., & T., S. (2026). Thermal-Electrical Fusion for Real-Time Condition Monitoring of IGBT Modules in Transportation Systems.. Micromachines (Basel). https://doi.org/10.3390/mi17020154

Source records

europe-pmc · retrieved 2026-11-10T07:06:41.990Z
doaj · retrieved 2026-11-10T07:06:41.967Z