2D and 3D Interdigital Capacitors and Bias Tees Technologies on MnM Interposer for mmWave Applications.

Griep G, Bovadilla RG, Gomes LG, Cartagena LQ, Rehder GP, Serrano ALC

DOI: 10.3390/mi17020274
Published: 2026 Feb 23
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17020274,
  title = {2D and 3D Interdigital Capacitors and Bias Tees Technologies on MnM Interposer for mmWave Applications.},
  author = {Griep G and Bovadilla RG and Gomes LG and Cartagena LQ and Rehder GP and Serrano ALC},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17020274},
  url = {https://doi.org/10.3390/mi17020274}
}

RIS

TY  - JOUR
TI  - 2D and 3D Interdigital Capacitors and Bias Tees Technologies on MnM Interposer for mmWave Applications.
AU  - Griep G
AU  - Bovadilla RG
AU  - Gomes LG
AU  - Cartagena LQ
AU  - Rehder GP
AU  - Serrano ALC
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17020274
UR  - https://doi.org/10.3390/mi17020274
ER  -

APA

G, G., RG, B., LG, G., LQ, C., GP, R., & ALC, S. (2026). 2D and 3D Interdigital Capacitors and Bias Tees Technologies on MnM Interposer for mmWave Applications.. Micromachines. https://doi.org/10.3390/mi17020274

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pubmed · retrieved 2026-09-27T07:24:04.353Z