An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires
- DOI
- 10.3390/mi17040411
- Published
- 2026-03-27
- Container
- Micromachines
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/mi17040411,
title = {An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires},
author = {Xu Wang and Zhiwei Xu and Chengjia Zhu and Tian Zhang and Qiang Tang and Junchao Zhang and Yinlong Zhu},
year = {2026},
journal = {Micromachines},
doi = {10.3390/mi17040411},
url = {https://doi.org/10.3390/mi17040411}
}RIS
TY - JOUR TI - An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires AU - Xu Wang AU - Zhiwei Xu AU - Chengjia Zhu AU - Tian Zhang AU - Qiang Tang AU - Junchao Zhang AU - Yinlong Zhu PY - 2026 JO - Micromachines DO - 10.3390/mi17040411 UR - https://doi.org/10.3390/mi17040411 ER -
APA
Wang, X., Xu, Z., Zhu, C., Zhang, T., Tang, Q., Zhang, J., & Zhu, Y. (2026). An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires. Micromachines. https://doi.org/10.3390/mi17040411
Source records
- crossref · retrieved 2026-09-25T06:35:04.220Z