An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires

Xu Wang, Zhiwei Xu, Chengjia Zhu, Tian Zhang, Qiang Tang, Junchao Zhang, Yinlong Zhu

Open source

DOI
10.3390/mi17040411
Published
2026-03-27
Container
Micromachines
Publisher
MDPI AG
Open access
unknown

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BibTeX

@article{allodium:10.3390/mi17040411,
  title = {An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires},
  author = {Xu Wang and Zhiwei Xu and Chengjia Zhu and Tian Zhang and Qiang Tang and Junchao Zhang and Yinlong Zhu},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17040411},
  url = {https://doi.org/10.3390/mi17040411}
}

RIS

TY  - JOUR
TI  - An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires
AU  - Xu Wang
AU  - Zhiwei Xu
AU  - Chengjia Zhu
AU  - Tian Zhang
AU  - Qiang Tang
AU  - Junchao Zhang
AU  - Yinlong Zhu
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17040411
UR  - https://doi.org/10.3390/mi17040411
ER  - 

APA

Wang, X., Xu, Z., Zhu, C., Zhang, T., Tang, Q., Zhang, J., & Zhu, Y. (2026). An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires. Micromachines. https://doi.org/10.3390/mi17040411

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