Design and Implementation of High-Capacity DDR3 Micro-Module Based on 3D TSV Advanced Packaging

Haoyue Ji, Liang Zeng, Hongwen Qian, Wenchao Tian, Jingjing Lin, Yuhe Duan

Open source

DOI: 10.3390/mi17040459
Published: 2026-04-09
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17040459,
  title = {Design and Implementation of High-Capacity DDR3 Micro-Module Based on 3D TSV Advanced Packaging},
  author = {Haoyue Ji and Liang Zeng and Hongwen Qian and Wenchao Tian and Jingjing Lin and Yuhe Duan},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17040459},
  url = {https://doi.org/10.3390/mi17040459}
}

RIS

TY  - JOUR
TI  - Design and Implementation of High-Capacity DDR3 Micro-Module Based on 3D TSV Advanced Packaging
AU  - Haoyue Ji
AU  - Liang Zeng
AU  - Hongwen Qian
AU  - Wenchao Tian
AU  - Jingjing Lin
AU  - Yuhe Duan
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17040459
UR  - https://doi.org/10.3390/mi17040459
ER  -

APA

Ji, H., Zeng, L., Qian, H., Tian, W., Lin, J., & Duan, Y. (2026). Design and Implementation of High-Capacity DDR3 Micro-Module Based on 3D TSV Advanced Packaging. Micromachines. https://doi.org/10.3390/mi17040459

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crossref · retrieved 2026-09-25T03:19:03.019Z