Mechanism of Tungsten Film Adhesion Enhancement on Alumina Ceramics via Microgroove Spacing During Multi-Abrasive Scratching.

Yang X, Wu J, Liu W, Ma W, Jiang C

DOI: 10.3390/mi17040465
Published: 2026 Apr 11
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17040465,
  title = {Mechanism of Tungsten Film Adhesion Enhancement on Alumina Ceramics via Microgroove Spacing During Multi-Abrasive Scratching.},
  author = {Yang X and Wu J and Liu W and Ma W and Jiang C},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17040465},
  url = {https://doi.org/10.3390/mi17040465}
}

RIS

TY  - JOUR
TI  - Mechanism of Tungsten Film Adhesion Enhancement on Alumina Ceramics via Microgroove Spacing During Multi-Abrasive Scratching.
AU  - Yang X
AU  - Wu J
AU  - Liu W
AU  - Ma W
AU  - Jiang C
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17040465
UR  - https://doi.org/10.3390/mi17040465
ER  -

APA

X, Y., J, W., W, L., W, M., & C, J. (2026). Mechanism of Tungsten Film Adhesion Enhancement on Alumina Ceramics via Microgroove Spacing During Multi-Abrasive Scratching.. Micromachines. https://doi.org/10.3390/mi17040465

Source records

pubmed · retrieved 2026-09-26T13:23:13.790Z