Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching
- DOI
- 10.3390/mi17040466
- Published
- 2026-04-12
- Container
- Micromachines
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/mi17040466,
title = {Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching},
author = {Ke Wang and Xinghua Chen and Boju Hou and Peng Xu and Yufei Li and Xutong Liu and Huirong Shi and Ming Zhang and Hongding Wang},
year = {2026},
journal = {Micromachines},
doi = {10.3390/mi17040466},
url = {https://doi.org/10.3390/mi17040466}
}RIS
TY - JOUR TI - Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching AU - Ke Wang AU - Xinghua Chen AU - Boju Hou AU - Peng Xu AU - Yufei Li AU - Xutong Liu AU - Huirong Shi AU - Ming Zhang AU - Hongding Wang PY - 2026 JO - Micromachines DO - 10.3390/mi17040466 UR - https://doi.org/10.3390/mi17040466 ER -
APA
Wang, K., Chen, X., Hou, B., Xu, P., Li, Y., Liu, X., Shi, H., Zhang, M., & Wang, H. (2026). Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching. Micromachines. https://doi.org/10.3390/mi17040466
Source records
- crossref · retrieved 2026-09-25T13:20:12.345Z