Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II.

Liu J, Du M, Wu J, Gong S, Ouyang P, Huang S, Chen F

DOI: 10.3390/mi17060686
Published: 2026 Jun 1
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17060686,
  title = {Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II.},
  author = {Liu J and Du M and Wu J and Gong S and Ouyang P and Huang S and Chen F},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17060686},
  url = {https://doi.org/10.3390/mi17060686}
}

RIS

TY  - JOUR
TI  - Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II.
AU  - Liu J
AU  - Du M
AU  - Wu J
AU  - Gong S
AU  - Ouyang P
AU  - Huang S
AU  - Chen F
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17060686
UR  - https://doi.org/10.3390/mi17060686
ER  -

APA

J, L., M, D., J, W., S, G., P, O., S, H., & F, C. (2026). Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II.. Micromachines. https://doi.org/10.3390/mi17060686

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pubmed · retrieved 2026-09-25T14:29:36.179Z