A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management.

Wang H, Ding Y, Zhang Z, Zhang J, Zhang A, Pei X, Chen Z

DOI: 10.3390/mi17060724
Published: 2026 Jun 15
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17060724,
  title = {A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management.},
  author = {Wang H and Ding Y and Zhang Z and Zhang J and Zhang A and Pei X and Chen Z},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17060724},
  url = {https://doi.org/10.3390/mi17060724}
}

RIS

TY  - JOUR
TI  - A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management.
AU  - Wang H
AU  - Ding Y
AU  - Zhang Z
AU  - Zhang J
AU  - Zhang A
AU  - Pei X
AU  - Chen Z
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17060724
UR  - https://doi.org/10.3390/mi17060724
ER  -

APA

H, W., Y, D., Z, Z., J, Z., A, Z., X, P., & Z, C. (2026). A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management.. Micromachines. https://doi.org/10.3390/mi17060724

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pubmed · retrieved 2026-11-10T10:49:08.270Z