A Super Memory Processing Unit Based on 3D Stacking and Hybrid Bonding for High-Efficiency AI Computing

Ruiyong Zhao, Yibo Hu, Jing Chen

Open source

DOI: 10.3390/mi17070802
Published: 2026-06-30
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17070802,
  title = {A Super Memory Processing Unit Based on 3D Stacking and Hybrid Bonding for High-Efficiency AI Computing},
  author = {Ruiyong Zhao and Yibo Hu and Jing Chen},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17070802},
  url = {https://doi.org/10.3390/mi17070802}
}

RIS

TY  - JOUR
TI  - A Super Memory Processing Unit Based on 3D Stacking and Hybrid Bonding for High-Efficiency AI Computing
AU  - Ruiyong Zhao
AU  - Yibo Hu
AU  - Jing Chen
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17070802
UR  - https://doi.org/10.3390/mi17070802
ER  -

APA

Zhao, R., Hu, Y., & Chen, J. (2026). A Super Memory Processing Unit Based on 3D Stacking and Hybrid Bonding for High-Efficiency AI Computing. Micromachines. https://doi.org/10.3390/mi17070802

Source records

crossref · retrieved 2026-09-24T23:08:19.901Z