Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules.

Zhou J, Chen J, He L, Tang H, Wu X

DOI: 10.3390/mi17070827
Published: 2026 Jul 10
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17070827,
  title = {Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules.},
  author = {Zhou J and Chen J and He L and Tang H and Wu X},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17070827},
  url = {https://doi.org/10.3390/mi17070827}
}

RIS

TY  - JOUR
TI  - Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules.
AU  - Zhou J
AU  - Chen J
AU  - He L
AU  - Tang H
AU  - Wu X
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17070827
UR  - https://doi.org/10.3390/mi17070827
ER  -

APA

J, Z., J, C., L, H., H, T., & X, W. (2026). Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules.. Micromachines. https://doi.org/10.3390/mi17070827

Source records

pubmed · retrieved 2026-09-25T13:37:34.414Z