Study of the Orbital Circular Cutting in Quartz Wafers Using Electrochemical Discharge Machining with Micro-Electrodes.

Wang AC, Hung JC, Tsai YL, Tsui HP

DOI: 10.3390/mi17070832
Published: 2026 Jul 12
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17070832,
  title = {Study of the Orbital Circular Cutting in Quartz Wafers Using Electrochemical Discharge Machining with Micro-Electrodes.},
  author = {Wang AC and Hung JC and Tsai YL and Tsui HP},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17070832},
  url = {https://doi.org/10.3390/mi17070832}
}

RIS

TY  - JOUR
TI  - Study of the Orbital Circular Cutting in Quartz Wafers Using Electrochemical Discharge Machining with Micro-Electrodes.
AU  - Wang AC
AU  - Hung JC
AU  - Tsai YL
AU  - Tsui HP
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17070832
UR  - https://doi.org/10.3390/mi17070832
ER  -

APA

AC, W., JC, H., YL, T., & HP, T. (2026). Study of the Orbital Circular Cutting in Quartz Wafers Using Electrochemical Discharge Machining with Micro-Electrodes.. Micromachines. https://doi.org/10.3390/mi17070832

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pubmed · retrieved 2026-09-25T12:56:49.507Z