Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass–Ti/Cu Interfacial Adhesion

Tailong Shi, Wending Yang, Qi Li, Jingxuan Yang, Zhonghao Li, Hua Hong, Zhong Zhang, Guodong Zhang, Andrew C. Chang

Open source

DOI
10.3390/mi17070836
Published
2026-07-14
Container
Micromachines
Publisher
MDPI AG
Open access
unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.3390/mi17070836,
  title = {Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass–Ti/Cu Interfacial Adhesion},
  author = {Tailong Shi and Wending Yang and Qi Li and Jingxuan Yang and Zhonghao Li and Hua Hong and Zhong Zhang and Guodong Zhang and Andrew C. Chang},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17070836},
  url = {https://doi.org/10.3390/mi17070836}
}

RIS

TY  - JOUR
TI  - Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass–Ti/Cu Interfacial Adhesion
AU  - Tailong Shi
AU  - Wending Yang
AU  - Qi Li
AU  - Jingxuan Yang
AU  - Zhonghao Li
AU  - Hua Hong
AU  - Zhong Zhang
AU  - Guodong Zhang
AU  - Andrew C. Chang
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17070836
UR  - https://doi.org/10.3390/mi17070836
ER  - 

APA

Shi, T., Yang, W., Li, Q., Yang, J., Li, Z., Hong, H., Zhang, Z., Zhang, G., & Chang, A. C. (2026). Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass–Ti/Cu Interfacial Adhesion. Micromachines. https://doi.org/10.3390/mi17070836

Source records