An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis
- DOI
- 10.3390/mi17070853
- Published
- 2026-07-17
- Container
- Micromachines
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/mi17070853,
title = {An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis},
author = {Pengying Xu and Shaoyi Liu and Lu Hao and Jitang Zhang and Yan Wang and Qiulin Tan and Congsi Wang},
year = {2026},
journal = {Micromachines},
doi = {10.3390/mi17070853},
url = {https://doi.org/10.3390/mi17070853}
}RIS
TY - JOUR TI - An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis AU - Pengying Xu AU - Shaoyi Liu AU - Lu Hao AU - Jitang Zhang AU - Yan Wang AU - Qiulin Tan AU - Congsi Wang PY - 2026 JO - Micromachines DO - 10.3390/mi17070853 UR - https://doi.org/10.3390/mi17070853 ER -
APA
Xu, P., Liu, S., Hao, L., Zhang, J., Wang, Y., Tan, Q., & Wang, C. (2026). An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis. Micromachines. https://doi.org/10.3390/mi17070853
Source records
- crossref · retrieved 2026-09-27T05:21:10.799Z