Electrochemical Microstructuring of Columnar Cu(2)O Layers Through Preferential Grain Boundary Dissolution.

Khoo PL, Kono M, Sakai K, Kobayashi M, Izaki M

DOI: 10.3390/mi17080979
Published: 2026 Aug 19
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17080979,
  title = {Electrochemical Microstructuring of Columnar Cu(2)O Layers Through Preferential Grain Boundary Dissolution.},
  author = {Khoo PL and Kono M and Sakai K and Kobayashi M and Izaki M},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17080979},
  url = {https://doi.org/10.3390/mi17080979}
}

RIS

TY  - JOUR
TI  - Electrochemical Microstructuring of Columnar Cu(2)O Layers Through Preferential Grain Boundary Dissolution.
AU  - Khoo PL
AU  - Kono M
AU  - Sakai K
AU  - Kobayashi M
AU  - Izaki M
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17080979
UR  - https://doi.org/10.3390/mi17080979
ER  -

APA

PL, K., M, K., K, S., M, K., & M, I. (2026). Electrochemical Microstructuring of Columnar Cu(2)O Layers Through Preferential Grain Boundary Dissolution.. Micromachines. https://doi.org/10.3390/mi17080979

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pubmed · retrieved 2026-11-10T12:22:32.872Z