Electrochemical Microstructuring of Columnar Cu2O Layers Through Preferential Grain Boundary Dissolution

Pei Loon Khoo, Mizuki Kono, Katsutoshi Sakai, Masakazu Kobayashi, Masanobu Izaki

Open source

DOI: 10.3390/mi17080979
Published: 2026-08-19
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17080979,
  title = {Electrochemical Microstructuring of Columnar Cu2O Layers Through Preferential Grain Boundary Dissolution},
  author = {Pei Loon Khoo and Mizuki Kono and Katsutoshi Sakai and Masakazu Kobayashi and Masanobu Izaki},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17080979},
  url = {https://doi.org/10.3390/mi17080979}
}

RIS

TY  - JOUR
TI  - Electrochemical Microstructuring of Columnar Cu2O Layers Through Preferential Grain Boundary Dissolution
AU  - Pei Loon Khoo
AU  - Mizuki Kono
AU  - Katsutoshi Sakai
AU  - Masakazu Kobayashi
AU  - Masanobu Izaki
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17080979
UR  - https://doi.org/10.3390/mi17080979
ER  -

APA

Khoo, P. L., Kono, M., Sakai, K., Kobayashi, M., & Izaki, M. (2026). Electrochemical Microstructuring of Columnar Cu2O Layers Through Preferential Grain Boundary Dissolution. Micromachines. https://doi.org/10.3390/mi17080979

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crossref · retrieved 2026-09-25T14:29:12.682Z