Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints.

Xiao Y, Bai Y, He X, Cui Q, Cheng L, Yang R, Zhang Q, Wang Y

DOI: 10.3390/mi17091034
Published: 2026 Aug 29
Container: Micromachines
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17091034,
  title = {Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints.},
  author = {Xiao Y and Bai Y and He X and Cui Q and Cheng L and Yang R and Zhang Q and Wang Y},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17091034},
  url = {https://doi.org/10.3390/mi17091034}
}

RIS

TY  - JOUR
TI  - Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints.
AU  - Xiao Y
AU  - Bai Y
AU  - He X
AU  - Cui Q
AU  - Cheng L
AU  - Yang R
AU  - Zhang Q
AU  - Wang Y
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17091034
UR  - https://doi.org/10.3390/mi17091034
ER  -

APA

Y, X., Y, B., X, H., Q, C., L, C., R, Y., Q, Z., & Y, W. (2026). Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints.. Micromachines. https://doi.org/10.3390/mi17091034

Source records

pubmed · retrieved 2026-09-26T18:14:46.287Z