Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability

Yuxian Huang, Dingguan Wang, Qianyi Li, Zhiming Pan

Open source

DOI: 10.3390/mi17091039
Published: 2026-08-30
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17091039,
  title = {Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability},
  author = {Yuxian Huang and Dingguan Wang and Qianyi Li and Zhiming Pan},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17091039},
  url = {https://doi.org/10.3390/mi17091039}
}

RIS

TY  - JOUR
TI  - Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability
AU  - Yuxian Huang
AU  - Dingguan Wang
AU  - Qianyi Li
AU  - Zhiming Pan
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17091039
UR  - https://doi.org/10.3390/mi17091039
ER  -

APA

Huang, Y., Wang, D., Li, Q., & Pan, Z. (2026). Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability. Micromachines. https://doi.org/10.3390/mi17091039

Source records

crossref · retrieved 2026-09-26T13:47:37.552Z