Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.

Do HR, Wee JH, Lee HR, Lee YC, Song Y, Pyo SG

DOI: 10.3390/mi17091065
Published: 2026 Sep 8
Container: Micromachines
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17091065,
  title = {Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.},
  author = {Do HR and Wee JH and Lee HR and Lee YC and Song Y and Pyo SG},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17091065},
  url = {https://doi.org/10.3390/mi17091065}
}

RIS

TY  - JOUR
TI  - Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.
AU  - Do HR
AU  - Wee JH
AU  - Lee HR
AU  - Lee YC
AU  - Song Y
AU  - Pyo SG
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17091065
UR  - https://doi.org/10.3390/mi17091065
ER  -

APA

HR, D., JH, W., HR, L., YC, L., Y, S., & SG, P. (2026). Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.. Micromachines. https://doi.org/10.3390/mi17091065

Source records

pubmed · retrieved 2026-09-26T17:08:22.659Z