Universal Parafilm(®)-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates.

Yang Z, Lou Y, Chen S, Chen Y, Sun L, Tian J, Cao R

DOI: 10.3390/mi17101136
Published: 2026 Sep 29
Container: Micromachines
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/mi17101136,
  title = {Universal Parafilm(®)-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates.},
  author = {Yang Z and Lou Y and Chen S and Chen Y and Sun L and Tian J and Cao R},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17101136},
  url = {https://doi.org/10.3390/mi17101136}
}

RIS

TY  - JOUR
TI  - Universal Parafilm(®)-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates.
AU  - Yang Z
AU  - Lou Y
AU  - Chen S
AU  - Chen Y
AU  - Sun L
AU  - Tian J
AU  - Cao R
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17101136
UR  - https://doi.org/10.3390/mi17101136
ER  -

APA

Z, Y., Y, L., S, C., Y, C., L, S., J, T., & R, C. (2026). Universal Parafilm(®)-Mediated Thermal Bonding for Gold Leaf Electrode Patterning and Microfluidic Assembly on Diverse Substrates.. Micromachines. https://doi.org/10.3390/mi17101136

Source records

pubmed · retrieved 2026-11-10T06:40:56.157Z