Microstructured Finger-Joint Interfaces for Reducing Thermal Contact Resistance in Thermal Pad Assemblies

Menglin Li, Jie Liu, Mingyang Ma

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DOI: 10.3390/mi17101142
Published: 2026-09-30
Container: Micromachines
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/mi17101142,
  title = {Microstructured Finger-Joint Interfaces for Reducing Thermal Contact Resistance in Thermal Pad Assemblies},
  author = {Menglin Li and Jie Liu and Mingyang Ma},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17101142},
  url = {https://doi.org/10.3390/mi17101142}
}

RIS

TY  - JOUR
TI  - Microstructured Finger-Joint Interfaces for Reducing Thermal Contact Resistance in Thermal Pad Assemblies
AU  - Menglin Li
AU  - Jie Liu
AU  - Mingyang Ma
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17101142
UR  - https://doi.org/10.3390/mi17101142
ER  -

APA

Li, M., Liu, J., & Ma, M. (2026). Microstructured Finger-Joint Interfaces for Reducing Thermal Contact Resistance in Thermal Pad Assemblies. Micromachines. https://doi.org/10.3390/mi17101142

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crossref · retrieved 2026-11-10T14:30:36.519Z