Recovery of Over-Target RuO2-Based Thick-Film Resistors by Laser Surface Modification and Dual-Step Trimming: An 8P7R Feasibility Study Toward Multilayer Hybrid Integrated Circuits

Yuan-Hwei Cheng, Jin-Siang Shaw

Open source

DOI
10.3390/mi17101164
Published
2026-10-05
Container
Micromachines
Publisher
MDPI AG
Open access
unknown

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BibTeX

@article{allodium:10.3390/mi17101164,
  title = {Recovery of Over-Target RuO2-Based Thick-Film Resistors by Laser Surface Modification and Dual-Step Trimming: An 8P7R Feasibility Study Toward Multilayer Hybrid Integrated Circuits},
  author = {Yuan-Hwei Cheng and Jin-Siang Shaw},
  year = {2026},
  journal = {Micromachines},
  doi = {10.3390/mi17101164},
  url = {https://doi.org/10.3390/mi17101164}
}

RIS

TY  - JOUR
TI  - Recovery of Over-Target RuO2-Based Thick-Film Resistors by Laser Surface Modification and Dual-Step Trimming: An 8P7R Feasibility Study Toward Multilayer Hybrid Integrated Circuits
AU  - Yuan-Hwei Cheng
AU  - Jin-Siang Shaw
PY  - 2026
JO  - Micromachines
DO  - 10.3390/mi17101164
UR  - https://doi.org/10.3390/mi17101164
ER  - 

APA

Cheng, Y., & Shaw, J. (2026). Recovery of Over-Target RuO2-Based Thick-Film Resistors by Laser Surface Modification and Dual-Step Trimming: An 8P7R Feasibility Study Toward Multilayer Hybrid Integrated Circuits. Micromachines. https://doi.org/10.3390/mi17101164

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